Related reading
TSMC revealing details about next gen A14 node
TSMC’s upcoming A14 NanoFlex Pro node promises the world’s smallest SRAM cell (<0.017 µm²) and up to 30% power savings, with a 10‑15% speed boost and ~20% density increase over N2. The platform also introduces TSV and RDL innovations for 4.5 µm SoIC bonding, targeting volume production in 2028.
Hacker News front pagemapyourshow.com1 mintalkHN12455Original Sony PlayStation 2 security chip 'broken wide open' after 26 years
A Canadian hobbyist spent four years chemically decapping and optically dumping the PS2’s CXP102064 MechaCon security chip, finally releasing its ROM. The dump opens up software disc backups, modchip development, and future low‑level emulation of the console’s security mechanisms.
Custom home server built from spare parts
A DIY home NAS built from a repurposed Zotac mini‑PC, 6×8 TB WD Red drives in a RAIDZ2 ZFS pool, encrypted boot, Wi‑Fi, custom Noctua cooling, and a front‑panel ESP32‑S3 touch screen driven by LVGL. Runs Kubuntu 24.04 with Docker‑Compose services behind Caddy, plus a self‑written dashboard and API.
Hacker News front pageasmat.ca7 minHN8949NVIDIA Launches DSX Ready to Qualify Power and Cooling Products for AI Factories
NVIDIA introduced DSX Ready, a qualification program for power and cooling products that meet its AI‑factory reference design requirements. The first categories—battery energy storage systems and cooling distribution units—now have qualified partners such as Hitachi Energy, LG, Tesla, LiquidStack, and Vertiv.
Nvidianvidia.com2 minreleaseSamsung is expected to more than double output of its HBM4 and HBM4E DRAM
Samsung plans to more than double its HBM4 and HBM4E output next year, raising glass‑carrier cleaning to 50 k sheets/month and wafer input to ~250 k per month. The HBM4 family’s share of shipments is expected to jump from ~40 % to ~80 % as the higher‑layer HBM4E ramps up.
Hacker News front pagesedaily.com2 minHN543426
